Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855057 | Package structure and method of forming the same | Chi-Yang Yu, Yu-Min Liang, Jiun Yi Wu | 2023-12-26 |
| 11854988 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2023-12-26 |
| 11766682 | Flow divider | Chen-Chen Li | 2023-09-26 |
| 11737205 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2023-08-22 |
| 11728217 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2023-08-15 |
| 11665834 | Electronic assembly having circuit carrier and manufacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2023-05-30 |
| 11664566 | Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission lines | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2023-05-30 |
| 11658164 | Electronics card including multi-chip module | Chen-Hua Yu, Jiun Yi Wu | 2023-05-23 |
| 11658134 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu | 2023-05-23 |
| 11658085 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chung-Shi Liu | 2023-05-23 |
| 11652086 | Packages with stacked dies and methods of forming the same | Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2023-05-16 |
| 11602056 | Circuit board and semiconductor device including the same | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2023-03-07 |