Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11765975 | Thermocouple device | Ming-Hsien Tsai, Shang-Ying Tsai, Shih-Ming Yang, Jheng-Yuan Wang, Ming-De Chen | 2023-09-19 |
| 11737205 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2023-08-22 |
| 11711056 | Method of using varainductor having ground and floating planes | Yi-Hsuan Liu, Hsieh-Hung Hsieh, Chewn-Pu Jou | 2023-07-25 |
| 11664566 | Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission lines | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2023-05-30 |