Issued Patents 2023
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854988 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee | 2023-12-26 |
| 11855057 | Package structure and method of forming the same | Chi-Yang Yu, Yu-Min Liang, Chien-Hsun Lee | 2023-12-26 |
| 11848304 | Semiconductor device and method of forming the same | Chen-Hua Yu, Shang-Yun Hou | 2023-12-19 |
| 11848234 | Semiconductor package and method comprising formation of redistribution structure and interconnecting die | Chen-Hua Yu | 2023-12-19 |
| 11837567 | Semiconductor package and method of forming thereof | Chen-Hua Yu | 2023-12-05 |
| 11830797 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2023-11-28 |
| 11824032 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2023-11-21 |
| 11817380 | Semiconductor package and method of forming same | Chen-Hua Yu, Chung-Shi Liu | 2023-11-14 |
| 11817325 | Methods of manufacturing a semiconductor package | Chen-Hua Yu | 2023-11-14 |
| 11810847 | Package structure and method of fabricating the same | Chin-Liang Chen, Kuan-Lin Ho, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang | 2023-11-07 |
| 11791275 | Semiconductor device and method of manufacturing | Chen-Hua Yu | 2023-10-17 |
| 11784140 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2023-10-10 |
| 11776886 | Symmetrical substrate for semiconductor packaging | Chen-Hua Yu | 2023-10-03 |
| 11756945 | Semiconductor device package and methods of manufacture | Chen-Hua Yu | 2023-09-12 |
| 11756801 | Stencil structure and method of fabricating package | Chen-Hua Yu | 2023-09-12 |
| 11749594 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2023-09-05 |
| 11737205 | Interconnect structure having conductor extending along dielectric block | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2023-08-22 |
| 11728217 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2023-08-15 |
| 11715686 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chien-Hsun Chen | 2023-08-01 |
| 11705408 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Yu-Min Liang, Yen-Fu Su, Chien-Chang Lin +1 more | 2023-07-18 |
| 11705378 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Hsin-Yu Pan, Tsung-Ding Wang, Yu-Min Liang, Wei-Yu Chen | 2023-07-18 |
| 11699691 | Interposer frame and method of manufacturing the same | — | 2023-07-11 |
| 11688693 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Yu-Min Liang | 2023-06-27 |
| 11670575 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines | Chien-Hsun Chen, Shou-Yi Wang | 2023-06-06 |
| 11664566 | Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission lines | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2023-05-30 |