Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824032 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Jiun Yi Wu | 2023-11-21 |
| 11810847 | Package structure and method of fabricating the same | Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2023-11-07 |
| 11784106 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Wen-Lin Chen | 2023-10-10 |
| 11749594 | Semiconductor structure and manufacturing method thereof | Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2023-09-05 |
| 11688693 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Yu-Min Liang, Jiun Yi Wu | 2023-06-27 |
| 11616037 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Yu-Min Liang | 2023-03-28 |
| 11594479 | Semiconductor structure and manufacturing method thereof | Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2023-02-28 |