Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810847 | Package structure and method of fabricating the same | Chin-Liang Chen, Kuan-Lin Ho, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2023-11-07 |
| 11594479 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2023-02-28 |