Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855057 | Package structure and method of forming the same | Chi-Yang Yu, Jiun Yi Wu, Chien-Hsun Lee | 2023-12-26 |
| 11824032 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu | 2023-11-21 |
| 11810847 | Package structure and method of fabricating the same | Chin-Liang Chen, Kuan-Lin Ho, Pei-Rong Ni, Chia-Min Lin, Jiun Yi Wu | 2023-11-07 |
| 11784106 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Wen-Lin Chen | 2023-10-10 |
| 11749594 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Wei-Yu Chen | 2023-09-05 |
| 11705408 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2023-07-18 |
| 11705378 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Jiun Yi Wu, Hsin-Yu Pan, Tsung-Ding Wang, Wei-Yu Chen | 2023-07-18 |
| 11688693 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Jiun Yi Wu | 2023-06-27 |
| 11616037 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho | 2023-03-28 |
| 11594479 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Jiun Yi Wu | 2023-02-28 |