Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705378 | Semiconductor packages and methods of forming the same | Jiun Yi Wu, Hsin-Yu Pan, Tsung-Ding Wang, Yu-Min Liang, Wei-Yu Chen | 2023-07-18 |
| 11705408 | Semiconductor package | Chi-Yang Yu, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2023-07-18 |