Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705378 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Jiun Yi Wu, Hsin-Yu Pan, Yu-Min Liang, Wei-Yu Chen | 2023-07-18 |
| 11652086 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Mirng-Ji Lii, Chen-Hua Yu | 2023-05-16 |