Issued Patents 2023
Showing 1–25 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855067 | Integrated circuit package and method | Yung-Chi Lin, Wen-Chih Chiou | 2023-12-26 |
| 11854877 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Ying-Ching Shih, Pu Wang | 2023-12-26 |
| 11855029 | Semiconductor die connection system and method | Ming-Fa Chen, Sen-Bor Jan | 2023-12-26 |
| 11855063 | Buffer design for package integration | Jie Chen, Hsien-Wei Chen, Ming-Fa Chen | 2023-12-26 |
| 11855046 | Memory packages and methods of forming same | Chung-Hao Tsai, Chuei-Tang Wang, Yih Wang | 2023-12-26 |
| 11856800 | Semiconductor devices with system on chip devices | Hsien-Wei Chen, Wen-Chih Chiou, Ming-Fa Chen, Sung-Feng Yeh | 2023-12-26 |
| 11855020 | Chiplets 3D SoIC system integration and fabrication methods | Kuo-Chung Yee | 2023-12-26 |
| 11855014 | Semiconductor device and method | Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2023-12-26 |
| 11854998 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2023-12-26 |
| 11855047 | Chip package structure with conductive shielding film | An-Jhih Su, Jing-Cheng Lin, Po-Hao Tsai | 2023-12-26 |
| 11855018 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Tsung-Shu Lin, Wei-Cheng Wu | 2023-12-26 |
| 11854992 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu, Chun-Lin Lu | 2023-12-26 |
| 11854990 | Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die | Hsien-Pin Hu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2023-12-26 |
| 11855246 | Semiconductor device and method | Keng-Han Lin, Hung-Jui Kuo, Hui-Jung Tsai | 2023-12-26 |
| 11854986 | Chamfered die of semiconductor package and method for forming the same | Wei-Kang Hsieh, Shih-Wei Chen, Tin-Hao Kuo, Hao-Yi Tsai | 2023-12-26 |
| 11854988 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chung-Shi Liu, Chien-Hsun Lee | 2023-12-26 |
| 11854936 | Semiconductor device | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-12-26 |
| 11854921 | Integrated circuit package and method | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2023-12-26 |
| 11852868 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu | 2023-12-26 |
| 11854785 | Package structure for heat dissipation | Sung-Feng Yeh, Ming-Fa Chen | 2023-12-26 |
| 11854994 | Redistribution structure for integrated circuit package and method of forming same | An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2023-12-26 |
| 11855021 | Semiconductor structure with through substrate vias and manufacturing method thereof | Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-12-26 |
| 11855016 | Semiconductor device and method of manufacture | Tin-Hao Kuo, Chung-Shi Liu, Hao-Yi Tsai | 2023-12-26 |
| 11848271 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh | 2023-12-19 |
| 11848235 | System, device and methods of manufacture | Wei Ling Chang, Chuei-Tang Wang, Tin-Hao Kuo, Che-Wei Hsu | 2023-12-19 |