Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855028 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Sheng-Pin Yang, Hao-Chun Liu | 2023-12-26 |
| 11855014 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Tzung-Hui Lee | 2023-12-26 |
| 11848265 | Semiconductor package with improved interposer structure | Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2023-12-19 |
| 11824007 | Dual-sided routing in 3D SiP structure | Po-Hao Tsai, Po-Yao Chuang, Meng-Liang Lin, Shin-Puu Jeng, Techi Wong | 2023-11-21 |
| 11804451 | Package structure and method of fabricating the same | Shin-Puu Jeng, Shih-Ting Hung, Po-Yao Chuang | 2023-10-31 |
| 11637054 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Meng-Liang Lin, Shin-Puu Jeng, Po-Yao Chuang | 2023-04-25 |
| 11600573 | Structure and formation method of chip package with conductive support elements to reduce warpage | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng | 2023-03-07 |
| 11594484 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2023-02-28 |