Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11851321 | Micro-electro mechanical system and manufacturing method thereof | Kai-Di Wu, Ming-Da Cheng, Wen-Hsiung Lu, Cheng-Jen Lin, Chin Wei Kang | 2023-12-26 |
| 11855017 | Semiconductor device and method | Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang | 2023-12-26 |
| 11855028 | Hybrid micro-bump integration with redistribution layer | Po-Hao Tsai, Yi-Wen Wu, Sheng-Pin Yang, Hao-Chun Liu | 2023-12-26 |
| 11557508 | Semiconductor device structure having protection caps on conductive lines | Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku +1 more | 2023-01-17 |