Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855028 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Yi-Wen Wu, Hao-Chun Liu | 2023-12-26 |
| 11557508 | Semiconductor device structure having protection caps on conductive lines | Ting-Li Yang, Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku +1 more | 2023-01-17 |