Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855028 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Yi-Wen Wu, Sheng-Pin Yang | 2023-12-26 |
HL
Hao-Chun Liu
Overall (2023): #430,386 of 537,848Top 85%
1
Patents 2023