Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854835 | Heterogeneous bonding structure and method forming same | Mirng-Ji Lii, Chen-Shien Chen, Lung-Kai Mao, Ming-Da Cheng | 2023-12-26 |
| 11851321 | Micro-electro mechanical system and manufacturing method thereof | Ting-Li Yang, Kai-Di Wu, Ming-Da Cheng, Cheng-Jen Lin, Chin Wei Kang | 2023-12-26 |
| 11817413 | Semiconductor package structure comprising via structure and redistribution layer structure and method for forming the same | Neng-Chieh CHANG, Po-Hao Tsai, Ming-Da Cheng, Hsu-Lun Liu | 2023-11-14 |
| 11776881 | Semiconductor device and method | Hsu-Lun Liu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2023-10-03 |
| 11769716 | Semiconductor device and methods of forming the same | Yung-Sheng Lin, Cheng-Lung Yang, Chin-Yu Ku, Ming-Da Cheng, Tang-Wei Huang +1 more | 2023-09-26 |
| 11721579 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2023-08-08 |
| 11594508 | Redistribution lines having nano columns and method forming same | Po-Hao Tsai, Ming-Da Cheng, Hsu-Lun Liu, Kai-Di Wu, Su-Fei Lin | 2023-02-28 |
| 11569419 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Cheng-Jen Lin, Chin Wei Kang +1 more | 2023-01-31 |