Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854964 | Structure and formation method of semiconductor device with conductive bumps | Ming-Da Cheng, Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Po-Hao Tsai | 2023-12-26 |
| 11798907 | Semiconductor packages | Yun-Ching HUNG, An-Hsuan HSU, Chung-Hung LAI | 2023-10-24 |
| 11769716 | Semiconductor device and methods of forming the same | Cheng-Lung Yang, Chin-Yu Ku, Ming-Da Cheng, Wen-Hsiung Lu, Tang-Wei Huang +1 more | 2023-09-26 |
| 11721579 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao | 2023-08-08 |
| 11669639 | System and method for multi-user state change | Vivek Viswanathan Iyer, Daniel L. Hamlin | 2023-06-06 |