Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855058 | Package structure and method of forming the same | Wei-Hung Lin, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2023-12-26 |
| 11854964 | Structure and formation method of semiconductor device with conductive bumps | Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Po-Hao Tsai, Yung-Sheng Lin | 2023-12-26 |
| 11842935 | Method for forming a reconstructed package substrate comprising substrates blocks | Chen-Shien Chen, Kuo-Ching Hsu, Wei-Hung Lin, Ming-Da Cheng, Mirng-Ji Lii | 2023-12-12 |
| 11803085 | Electronic device | Shu-Han Yang, Chia-Min Yeh | 2023-10-31 |
| 11658187 | Electronic devices | Yu-Che CHANG, Li-Wei Sung, Cheng-Tso Chen, Chia-Min Yeh, Hung-Hsun Chen | 2023-05-23 |
| 11646485 | Liquid-crystal antenna device having first and second sealing members | Yi-Hung Lin, Chin-Lung Ting, Tang-Chin HUNG | 2023-05-09 |
| 11567377 | Electronic device with conductive lines on different levels | Chih-Hao Hsu, Chia-Min Yeh, Hsieh-Li Chou, Cheng-Tso Chen, Li-Wei Sung +1 more | 2023-01-31 |
| 11545465 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hsuan-Ting Kuo, Ming-Da Cheng | 2023-01-03 |