Issued Patents 2023
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855006 | Memory device, package structure and fabricating method thereof | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2023-12-26 |
| 11854789 | Method for manufacturing gate structure with additional oxide layer | Chih-Lin Wang, Kang-Min Kuo, Cheng-Wei Lian | 2023-12-26 |
| 11848300 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2023-12-19 |
| 11837550 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2023-12-05 |
| 11804434 | Integrated circuit apparatus and power distribution network thereof | Chan-Wei Hsu, Yun-Chih Chang | 2023-10-31 |
| 11776838 | Semiconductor package and manufacturing method thereof | Sheng-Chieh Yang, Shing-Chao Chen, Ching-Hua Hsieh | 2023-10-03 |
| 11760876 | Resin composition and article made therefrom | Chen-Yu Hsieh, Ching Lo | 2023-09-19 |
| 11740388 | Anti-glare film and polarizer with the same | Tsun Sheng Tao, Kuo-Hsuan Yu | 2023-08-29 |
| 11731327 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2023-08-22 |
| 11732160 | Composite film for use in LED wafer-level packaging process | Chun-Chi Hsu, Chun-Ting Lai | 2023-08-22 |
| 11728376 | Structure and formation method of semiconductor device structure with gate stack | Chih-Lin Wang, Kang-Min Kuo | 2023-08-15 |
| 11727714 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2023-08-15 |
| 11703385 | Light sensor with dark current elimination having duo switch-capacitor circuits and a reverse capacitor | Wen-Sheng Lin, Sheng-Cheng Lee, Yueh-Hung Ho, Chen-Hua Hsi | 2023-07-18 |
| 11688725 | Semiconductor packages | Sheng-Chieh Yang, Ching-Hua Hsieh, Yu-Hao Chen | 2023-06-27 |
| 11682639 | Semiconductor device and method of forming the same | Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai | 2023-06-20 |
| 11664287 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2023-05-30 |
| 11637139 | Semiconductor device including light-collimating layer and biometric device using the same | Chung-Ren Lao, Chih-Cherng Liao, Shih-Hao Liu, Wu-Hsi Lu, Ming-Cheng Lo +1 more | 2023-04-25 |
| 11626339 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2023-04-11 |
| 11611821 | Earphone with proximity sensing function | Sheng-Cheng Lee, Wen-Sheng Lin, Chen-Hua Hsi | 2023-03-21 |
| 11584019 | Substrate carrier deterioration detection and repair | Jen-Ti Wang, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung | 2023-02-21 |
| 11587887 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Shih-Peng Tai +2 more | 2023-02-21 |
| 11545465 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2023-01-03 |