Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855006 | Memory device, package structure and fabricating method thereof | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Sheng-Feng Weng +4 more | 2023-12-26 |
| 11640954 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Wei-Hung Lin, Ming-Da Cheng +1 more | 2023-05-02 |