Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855006 | Memory device, package structure and fabricating method thereof | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2023-12-26 |
| 11731327 | Molding apparatus and manufacturing method of molded semiconductor device | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2023-08-22 |