Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855006 | Memory device, package structure and fabricating method thereof | Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng +4 more | 2023-12-26 |
KC
Kai-Ming Chiang
Overall (2023): #375,857 of 537,848Top 70%
1
Patents 2023