Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855006 | Memory device, package structure and fabricating method thereof | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2023-12-26 |
| 11785723 | Lens module | Ching-Hui Chang | 2023-10-10 |
| 11731327 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Yao-Tong Lai +1 more | 2023-08-22 |
| 11705409 | Semiconductor device having antenna on chip package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen | 2023-07-18 |