Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824005 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu, Kai-Chiang Wu | 2023-11-21 |
| 11705409 | Semiconductor device having antenna on chip package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Meng-Tse Chen, Sheng-Hsiang Chiu | 2023-07-18 |
| 11569562 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Chun-Lin Lu, Kai-Chiang Wu, Chung-Yi Hsu | 2023-01-31 |
| 11551999 | Memory device and manufacturing method thereof | Lipu Kris Chuang, Chung-Shi Liu, Hsin-Yu Pan, Ming-Kai Liu, Ting-Chu Ko | 2023-01-10 |