Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855011 | Package structure and method of forming the same | Kai-Chiang Wu, Yen-Ping Wang | 2023-12-26 |
| 11569562 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2023-01-31 |