Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855011 | Package structure and method of forming the same | Chung-Yi Hsu, Yen-Ping Wang | 2023-12-26 |
| 11854992 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu | 2023-12-26 |
| 11824005 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu, Han-Ping Pu | 2023-11-21 |
| 11749626 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2023-09-05 |
| 11742219 | Integrated fan-out package and manufacturing method thereof | Chung-Hao Tsai, Chun-Lin Lu, Yen-Ping Wang, Che-Wei Hsu | 2023-08-29 |
| 11682619 | Package component, semiconductor package and manufacturing method thereof | Fang-Yu Liang | 2023-06-20 |
| 11682629 | Package structure and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2023-06-20 |
| 11658105 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Hung-Jui Kuo, Ming-Che Ho | 2023-05-23 |
| 11656391 | Aperture design and methods thereof | Hung-Chih Hsieh, Yen-Liang Chen, Kai-Hsiung Chen, Po-Chung Cheng, Chih-Ming Ke | 2023-05-23 |
| 11630863 | Data storage based on encoded DNA sequences | Xing Su, Noureddine Tayebi, Grace Credo | 2023-04-18 |
| 11574857 | Semiconductor package and manufacturing method thereof | Ching-Feng Yang, Hsin-Yu Pan, Chien-Chang Lin | 2023-02-07 |
| 11569562 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Chun-Lin Lu, Han-Ping Pu, Chung-Yi Hsu | 2023-01-31 |
| 11569190 | Semiconductor structure and manufacturing method thereof | Chun-Lin Lu | 2023-01-31 |