Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705408 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su +1 more | 2023-07-18 |
| 11574857 | Semiconductor package and manufacturing method thereof | Ching-Feng Yang, Hsin-Yu Pan, Kai-Chiang Wu | 2023-02-07 |