Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855057 | Package structure and method of forming the same | Yu-Min Liang, Jiun Yi Wu, Chien-Hsun Lee | 2023-12-26 |
| 11824032 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang, Jiun Yi Wu | 2023-11-21 |
| 11784106 | Semiconductor package and manufacturing method thereof | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2023-10-10 |
| 11749594 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu, Yu-Min Liang, Wei-Yu Chen | 2023-09-05 |
| 11705408 | Semiconductor package | Jung Wei Cheng, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2023-07-18 |
| 11616037 | Integrated fan-out package and manufacturing method thereof | Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2023-03-28 |