Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824032 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu | 2023-11-21 |
| 11810847 | Package structure and method of fabricating the same | Kuan-Lin Ho, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2023-11-07 |
| 11784106 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2023-10-10 |
| 11749594 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2023-09-05 |
| 11616037 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2023-03-28 |
| 11594479 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2023-02-28 |