Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658105 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Hung-Jui Kuo, Kai-Chiang Wu, Ming-Che Ho | 2023-05-23 |
| 11574857 | Semiconductor package and manufacturing method thereof | Hsin-Yu Pan, Kai-Chiang Wu, Chien-Chang Lin | 2023-02-07 |