Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855014 | Semiconductor device and method | Chen-Hua Yu, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2023-12-26 |
| 11842955 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure | Chen-Hua Yu, Hung-Jui Kuo, Tzung-Hui Lee | 2023-12-12 |
| 11823981 | Semiconductor package and manufacturing method thereof | Wei-Chung Chang, Hung-Jui Kuo | 2023-11-21 |
| 11775063 | Display device and display method | Wen Lin Tsai | 2023-10-03 |
| 11658105 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Hung-Jui Kuo, Kai-Chiang Wu | 2023-05-23 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2023-05-02 |
| 11626339 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2023-04-11 |
| 11605601 | Semiconductor package and method of forming the same | Ching-Wen Chen, Hung-Jui Kuo | 2023-03-14 |
| 11594484 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2023-02-28 |
| 11545457 | Semiconductor package, redistribution structure and method for forming the same | Chiang-Hao Lee, Hung-Jui Kuo | 2023-01-03 |