Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11809000 | Photonic integrated circuit and package structure | Tsung-Yuan Yu, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Hua-Kuei Lin +1 more | 2023-11-07 |
| 11768338 | Optical interconnect structure, package structure and fabricating method thereof | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +5 more | 2023-09-26 |
| 11754780 | Semiconductor package and manufacturing method thereof | Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2023-09-12 |
| 11754794 | Semiconductor device including optical through via and method of making | Yu-Hao Chen, Tsung-Yuan Yu, Hui Yu Lee, Hung-Yi Kuo, Jui-Feng Kuan +1 more | 2023-09-12 |
| 11740415 | Structures and process flow for integrated photonic-electric IC package by using polymer waveguide | Yu-Hao Chen, Hui Yu Lee, Jui-Feng Kuan, Chien-Te Wu | 2023-08-29 |
| 11686908 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2023-06-27 |
| 11664325 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2023-05-30 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2023-05-02 |
| 11635566 | Package and method of forming same | Chih-Hsuan Tai, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2023-04-25 |
| 11614592 | Semiconductor devices and methods of manufacture | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +4 more | 2023-03-28 |