Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855006 | Memory device, package structure and fabricating method thereof | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2023-12-26 |
| 11852967 | Methods for making semiconductor-based integrated circuits | Hui Yu Lee, Jui-Feng Kuan, Chien-Te Wu | 2023-12-26 |
| 11817324 | Info packages including thermal dissipation blocks | Ching-Yi Lin, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee, Shuo-Mao Chen | 2023-11-14 |
| 11774468 | Vertical probe head | Chin-Tien Yang, Yang-Hung Cheng, Chin-Yi Tsai, Hui-Pin Yang, Horng-Chuan Sun | 2023-10-03 |
| 11754794 | Semiconductor device including optical through via and method of making | Chung-Ming Weng, Tsung-Yuan Yu, Hui Yu Lee, Hung-Yi Kuo, Jui-Feng Kuan +1 more | 2023-09-12 |
| 11740415 | Structures and process flow for integrated photonic-electric IC package by using polymer waveguide | Hui Yu Lee, Chung-Ming Weng, Jui-Feng Kuan, Chien-Te Wu | 2023-08-29 |
| 11688725 | Semiconductor packages | Sheng-Chieh Yang, Ching-Hua Hsieh, Chih-Wei Lin | 2023-06-27 |
| 11609374 | Directionally tunable optical reflector | Hui Yu Lee, Jui-Feng Kuan, Chien-Te Wu | 2023-03-21 |