Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842946 | Semiconductor package having an encapsulant comprising conductive fillers and method of manufacture | Xinyu BAO, Lee-Chung Lu, Fong-Yuan Chang, Sam Vaziri, Po-Hsiang Huang | 2023-12-12 |
| 11817324 | Info packages including thermal dissipation blocks | Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Shuo-Mao Chen | 2023-11-14 |