Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842946 | Semiconductor package having an encapsulant comprising conductive fillers and method of manufacture | Xinyu BAO, Lee-Chung Lu, Jyh Chwen Frank Lee, Fong-Yuan Chang, Po-Hsiang Huang | 2023-12-12 |