Issued Patents 2023
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855066 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2023-12-26 |
| 11848305 | Semiconductor packages including passive devices and methods of forming same | Shin-Puu Jeng, Po-Yao Chuang | 2023-12-19 |
| 11817324 | Info packages including thermal dissipation blocks | Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee | 2023-11-14 |
| 11810830 | Chip package structure with cavity in interposer | Shin-Puu Jeng, Feng-Cheng Hsu | 2023-11-07 |
| 11791301 | Chip package structure | Shin-Puu Jeng, Feng-Cheng Hsu | 2023-10-17 |
| 11756892 | Method for forming chip package structure | Shin-Puu Jeng, Feng-Cheng Hsu, Po-Yao Lin | 2023-09-12 |
| 11756928 | Multi-chip packages | Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2023-09-12 |
| 11742220 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Jui-Pin Hung, Shin-Puu Jeng | 2023-08-29 |
| 11735572 | Integrated circuit package and method forming same | Shin-Puu Jeng, Feng-Cheng Hsu | 2023-08-22 |
| 11728256 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng | 2023-08-15 |
| 11675957 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou | 2023-06-13 |
| 11670577 | Chip package with redistribution structure having multiple chips | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Techi Wong | 2023-06-06 |
| 11610864 | Chip package structure and method of forming the same | Shin-Puu Jeng, Feng-Cheng Hsu | 2023-03-21 |
| 11605600 | Package structure with reinforced element and formation method thereof | Shin-Puu Jeng, Po-Yao Lin, Chia-Hsiang Lin | 2023-03-14 |
| 11581250 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Der-Chyang Yeh, Chiung-Han Yeh | 2023-02-14 |