Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856744 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chih-Han Lin | 2023-12-26 |
| 11855179 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Ya-Yi Tsai, Shu-Uei Jang, Chih-Han Lin, Shu-Yuan Ku | 2023-12-26 |
| 11854899 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chao-Cheng Chen, Chih-Han Lin, Chen-Ping Chen, Ming-Ching Chang +1 more | 2023-12-26 |
| 11798898 | Package structure | Hsien-Wen Liu, Shin-Puu Jeng | 2023-10-24 |
| 11756928 | Multi-chip packages | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2023-09-12 |
| 11721693 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Yu-Shan Cheng, Ming-Ching Chang | 2023-08-08 |
| 11688643 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chih-Han Lin | 2023-06-27 |
| 11652159 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chih-Han Lin | 2023-05-16 |
| 11563105 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Yu-Shan Cheng, Chao-Cheng Chen | 2023-01-24 |
| 11552195 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Li-Jung Kuo, Chen-Ping Chen, Ming-Ching Chang | 2023-01-10 |