Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798898 | Package structure | Hsiao-Wen Lee, Shin-Puu Jeng | 2023-10-24 |
| 11756928 | Multi-chip packages | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Shin-Puu Jeng, Hsiao-Wen Lee | 2023-09-12 |
| 11688728 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Jui-Pin Hung, Min-Chen Lin | 2023-06-27 |