Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742220 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2023-08-29 |
| 11688728 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Hsien-Wen Liu, Min-Chen Lin | 2023-06-27 |
| 11557546 | Semiconductor structure | Chen-Hua Yu, Kuo-Chung Yee | 2023-01-17 |