Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855066 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2023-12-26 |
| 11810830 | Chip package structure with cavity in interposer | Shin-Puu Jeng, Shuo-Mao Chen | 2023-11-07 |
| 11791301 | Chip package structure | Shin-Puu Jeng, Shuo-Mao Chen | 2023-10-17 |
| 11756892 | Method for forming chip package structure | Shin-Puu Jeng, Shuo-Mao Chen, Po-Yao Lin | 2023-09-12 |
| 11756928 | Multi-chip packages | Shuo-Mao Chen, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2023-09-12 |
| 11742310 | Method of manufacturing semiconductor device | Jing-Cheng Lin | 2023-08-29 |
| 11742220 | Integrated passive device package and methods of forming same | Shuo-Mao Chen, Jui-Pin Hung, Shin-Puu Jeng | 2023-08-29 |
| 11735572 | Integrated circuit package and method forming same | Shin-Puu Jeng, Shuo-Mao Chen | 2023-08-22 |
| 11728256 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Shin-Puu Jeng | 2023-08-15 |
| 11670577 | Chip package with redistribution structure having multiple chips | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Shuo-Mao Chen, Techi Wong | 2023-06-06 |
| 11610864 | Chip package structure and method of forming the same | Shuo-Mao Chen, Shin-Puu Jeng | 2023-03-21 |
| 11600597 | Semiconductor package structure | Shin-Puu Jeng | 2023-03-07 |