Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855066 | Semiconductor structure and manufacturing method thereof | Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2023-12-26 |
| 11828790 | Circuit test structure and method of using | Ching-Fang Chen, Chih-Hsien Lin | 2023-11-28 |
| 11616029 | Delamination sensor | Chih-Hsuan Tai, Ming-Chung Wu, Kuo-Wen Chen | 2023-03-28 |