Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855066 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2023-12-26 |
| 11828790 | Circuit test structure and method of using | Ching-Fang Chen, Hsiang-Tai Lu | 2023-11-28 |
| 11670594 | Redistribution layer features | Wen-Chun Wang, Tzy-Kuang Lee, Ching-Hung Kao, Yen-Yu Chen | 2023-06-06 |