Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784198 | Wide channel semiconductor device | Chia-Yu Wei, Fu-Cheng Chang, Hsin-Chi Chen, Chia-Pin Cheng, Kuo-Cheng Lee +2 more | 2023-10-10 |
| 11682549 | Semiconductor wafer with modified surface and fabrication method thereof | Yao-Wen Hsu, Po-Jen Wang, Tsung-Han Tsai | 2023-06-20 |
| 11670594 | Redistribution layer features | Wen-Chun Wang, Tzy-Kuang Lee, Chih-Hsien Lin, Yen-Yu Chen | 2023-06-06 |
| 11605709 | Circuit structure and method for reducing electronic noises | Chi-Feng Huang, Fu-Huan Tsai, Victor Chiang Liang | 2023-03-14 |