Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670594 | Redistribution layer features | Wen-Chun Wang, Chih-Hsien Lin, Ching-Hung Kao, Yen-Yu Chen | 2023-06-06 |
| 11621165 | Blocking structures on isolation structures | Yu-Hsuan Yang, Wen-Han Hung, Chia-Ying Lin | 2023-04-04 |