Issued Patents 2023
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855004 | Package structure | Chia-Kuei Hsu, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11854837 | Semiconductor devices and methods of manufacturing | Po-Chen Lai, Po-Yao Lin, Chien-Sheng Chen, Shin-Puu Jeng | 2023-12-26 |
| 11830800 | Metallization structure and package structure | Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-11-28 |
| 11784148 | Semiconductor package | Chia-Kuei Hsu, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2023-10-10 |
| 11764169 | Semiconductor device package with warpage control structure | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2023-09-19 |
| 11756873 | Semiconductor package and manufacturing method thereof | Chia-Kuei Hsu, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2023-09-12 |
| 11749644 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2023-09-05 |
| 11742322 | Integrated fan-out package having stress release structure | Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-08-29 |
| 11728284 | Chip package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Chia-Kuei Hsu, Li-Ling Liao, Po-Yao Lin +1 more | 2023-08-15 |
| 11728256 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2023-08-15 |
| 11721643 | Package structure | Po-Chen Lai, Chin-Hua Wang, Che-Chia Yang, Shu-Shen Yeh, Po-Yao Lin +1 more | 2023-08-08 |
| 11705420 | Multi-bump connection to interconnect structure and manufacturing method thereof | Tsung-Yen Lee, Chia-Kuei Hsu, Shang-Lun Tsai, Po-Yao Lin | 2023-07-18 |
| 11705406 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Li-Ling Liao, Tsung-Yen Lee, Po-Yao Lin +1 more | 2023-07-18 |
| 11699668 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2023-07-11 |
| 11694941 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2023-07-04 |
| 11652037 | Semiconductor package and method of manufacture | Chia-Kuei Hsu, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-05-16 |
| 11610835 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-03-21 |
| 11610854 | Semiconductor device and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2023-03-21 |
| 11600575 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Po-Yao Lin, Po-Hao Tsai, Po-Yao Chuang | 2023-03-07 |
| 11594477 | Semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-02-28 |
| 11557559 | Package structure | Tsung-Yen Lee, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2023-01-17 |