Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855008 | Stacking via structures for stress reduction | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2023-12-26 |
| 11855004 | Package structure | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11784130 | Structure and formation method of package with underfill | Yu-Sheng Lin, Shin-Puu Jeng, Po-Yao Lin, Chin-Hua Wang, Shu-Shen Yeh | 2023-10-10 |
| 11749644 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-09-05 |
| 11728233 | Chip package structure with ring structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Kuang-Chun Lee +2 more | 2023-08-15 |
| 11721643 | Package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin +1 more | 2023-08-08 |
| 11699668 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-07-11 |
| 11694941 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-07-04 |
| 11670601 | Stacking via structures for stress reduction | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2023-06-06 |