Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855009 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2023-12-26 |
| 11764118 | Structure and formation method of chip package with protective lid | Wen-Yi Lin, Chien-Chen Li, Chen-Shien Chen | 2023-09-19 |
| 11728233 | Chip package structure with ring structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Che-Chia Yang +2 more | 2023-08-15 |
| 11694974 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2023-07-04 |