Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854956 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Kuo-Ching Hsu, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11855009 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11817382 | Package substrate insulation opening design | Shu-Jung Tseng | 2023-11-14 |
| 11804445 | Method for forming chip package structure | Heh-Chang Huang, Fu-Jen Li, Pei-Haw Tsao | 2023-10-31 |
| 11699631 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Po-Yao Lin, Hui Yu, Shin-Puu Jeng | 2023-07-11 |