Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804445 | Method for forming chip package structure | Heh-Chang Huang, Pei-Haw Tsao, Shyue-Ter Leu | 2023-10-31 |
| 11764169 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Po-Yao Lin, Kuo-Chuan Liu | 2023-09-19 |
| 11600562 | Semiconductor packages and method of manufacturing the same | Shu-Jung Tseng | 2023-03-07 |