Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817382 | Package substrate insulation opening design | Shyue-Ter Leu | 2023-11-14 |
| 11600562 | Semiconductor packages and method of manufacturing the same | Fu-Jen Li | 2023-03-07 |
ST
Shu-Jung Tseng
Overall (2023): #108,098 of 537,848Top 25%
2
Patents 2023