Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764169 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2023-09-19 |
| 11579190 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2023-02-14 |