Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11852672 | Test circuit and method | Mill-Jer Wang, Ching-Nen Peng, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen | 2023-12-26 |
| 11585831 | Test probing structure | Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chao-Yang Yeh +2 more | 2023-02-21 |
| 11579190 | Testing holders for chip unit and die package | Mill-Jer Wang, Kuo-Chuan Liu, Ching-Nen Peng, Hao Chen | 2023-02-14 |